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PCB Cost Estimator
Configure your PCB specifications
5 Days
📊
Cost Breakdown
Estimated pricing details
Estimated Cost
$45.00
Total Cost
$4.50
Per Board
$0.45
Per cm²
Cost Factors
Base PCB$20.00
Surface Finish$12.00
Copper Weight$5.00
Lead Time Premium$8.00

This is an estimate. Actual pricing may vary based on design complexity and supplier. For accurate quotes, click "Request PCB Production Quote".

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Design for Manufacturing Tips
Best practices for producible PCB designs
01
Maintain Proper Clearances

Adequate spacing prevents manufacturing defects and ensures electrical isolation.

  • Trace-to-trace: Minimum 6 mil (0.15mm) for standard, 4 mil for HDI
  • Trace-to-pad: Minimum 8 mil (0.2mm) clearance
  • Board edge clearance: Keep copper minimum 0.5mm from board edge
  • Via-to-trace: Maintain 8 mil minimum spacing
CriticalElectrical
02
Optimize Via Design

Proper via design ensures reliable connections and reduces manufacturing costs.

  • Standard via: 0.3mm drill with 0.6mm pad (aspect ratio ≤8:1)
  • Annular ring: Minimum 0.125mm for reliable plating
  • Via-in-pad: Requires filling and capping, adds cost
  • Tented vias: Use solder mask over vias unless required for thermal relief
HolesReliability
03
Copper Balance & Plane Design

Even copper distribution prevents warping and ensures consistent etching.

  • Copper balance: Aim for 40-60% copper coverage on each layer
  • Thieving: Add copper thieving in sparse areas
  • Large pours: Use thermals on pads connected to planes
  • Split planes: Avoid acute angles in plane cutouts
ManufacturingSignal Integrity
04
Solder Mask & Silkscreen Guidelines

Proper mask and silk design improves assembly quality.

  • Solder mask expansion: 2-3 mil around pads
  • Mask dam: Minimum 4 mil between adjacent pads
  • Silkscreen line width: Minimum 6 mil for legibility
  • Silkscreen clearance: Keep 4 mil from exposed copper
AssemblyAesthetics
05
Panelization Best Practices

Efficient panelization reduces cost and improves assembly yield.

  • Panel rails: 5-10mm for tooling holes and fiducials
  • V-score: Best for straight edges, 0.4mm remaining thickness
  • Tab routing: Use mouse bites (5+ holes, 0.5mm) for complex shapes
  • Component clearance: Keep components 3mm from board edge
Cost SavingAssembly
06
High-Speed Design Considerations

Critical for signals above 100MHz or rise times below 1ns.

  • Impedance control: Specify stack-up for 50Ω single-ended, 90-100Ω differential
  • Length matching: Match differential pairs within 5 mils
  • Reference planes: Ensure continuous ground plane under high-speed traces
  • Via stubs: Use back-drilling for signals >5 Gbps
High-SpeedEMC
07
Thermal Management

Proper thermal design prevents component failure and improves reliability.

  • Thermal vias: Array of 0.3mm vias under thermal pads
  • Heavy copper: Use 2oz+ copper for high-current paths
  • Copper pours: Connect to heat-generating components
  • Keep-outs: Maintain space around hot components
ThermalReliability
08
File Generation Checklist

Complete manufacturing files prevent delays.

  • Gerber RS-274X: All copper layers, mask, silk, outline
  • Drill files: Excellon format with tool table
  • Stack-up: Layer order, materials, thickness
  • Assembly: Pick & place, BOM, assembly drawings
DocumentationFiles

Pro Tip: Always run a DRC (Design Rule Check) with your manufacturer's specific capabilities before submitting files.

🏭
How to Choose a PCB Supplier
Key factors for supplier selection
Selection Criteria
1
Technical Capabilities
  • Layer count support (2L to 20L+)
  • Minimum trace/space specifications
  • Material options (FR4, Rogers, aluminum)
  • Surface finish availability
  • Impedance control tolerance
2
Quality & Certifications
  • ISO 9001 certification
  • IPC-A-600 Class 2/3 compliance
  • UL listing capability
  • RoHS/REACH compliance
  • Automotive (IATF 16949) if required
3
Service & Support
  • DFM review service
  • Engineering support availability
  • Communication responsiveness
  • Quote turnaround time
  • Issue resolution process
4
Business Factors
  • Pricing competitiveness
  • Lead time options
  • MOQ flexibility
  • Shipping & logistics
  • Payment terms
📋
Supplier Evaluation Matrix
Compare suppliers by key metrics
Supplier TypeLead TimeCostBest For
Quick-Turn24-72h
$$$$$
Prototypes, urgent
Standard5-7 Days
$$$$$
Small batches
Volume2-3 Weeks
$$$$$
Mass production
Specialty1-2 Weeks
$$$$$
HDI, flex, RF
Questions to Ask Suppliers

✓ What is your standard layer stack-up configuration?

✓ Do you provide impedance control? What tolerance?

✓ What testing do you perform (E-test, AOI, X-ray)?

✓ Can you provide material certifications?

✓ What is your defect rate (DPPM)?

✓ Do you offer DFM review before production?

✓ What is your policy on quality issues?

Always request a sample order before committing to volume production. This helps verify quality and build a relationship with the supplier.

📏
Trace Width Calculator
Calculate trace width for current capacity
Results (IPC-2221)
15.2
Width (mil)
0.39
Width (mm)
0.045
Ω/inch

Add 20-50% margin to calculated values. Consider trace length, ambient temperature, and nearby heat sources.

⚡
Impedance Calculator
Microstrip & stripline impedance
Calculated Impedance
50.2
Ohms (Ω)
3.12
Effective Er
147
ps/inch

Common targets: 50Ω single-ended, 90Ω differential (USB), 100Ω differential (LVDS/Ethernet).

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Via Current Calculator
Calculate via current capacity
Via Specifications
0.85
Amps/Via
2.4
mΩ
5.3:1
Aspect Ratio
🌡️
Thermal Via Array
Calculate vias needed for heat dissipation
Recommended Array
9
Vias Needed
3×3
Array Size
1.2
Pitch (mm)

For best thermal performance, use copper-filled vias and connect to a large ground plane on the opposite side.

📚
Stack-up Configuration
Select and visualize layer structure
Stack-up Properties
1.6
Total (mm)
4.3
Er
140
Tg (°C)
👁️
Layer Visualization
Visual representation of PCB layers
Solder Mask
Top solder mask
L1 - Signal
Top copper - 1oz
Prepreg
FR-4 Prepreg
L2 - GND
Ground plane - 1oz
Core
FR-4 Core - 1.0mm
L3 - PWR
Power plane - 1oz
Prepreg
FR-4 Prepreg
L4 - Signal
Bottom copper - 1oz
Solder Mask
Bottom solder mask

For impedance-controlled designs, always request the exact stack-up from your manufacturer.

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Gerber File Checklist
Required files for PCB fabrication
Completion Status0%
Copper Layers
Top Copper Layer (*.GTL)
Required
Bottom Copper Layer (*.GBL)
Required
Inner Layer 1 (*.G2)
If multi-layer
Inner Layer 2 (*.G3)
If multi-layer
Mask & Silk Layers
Top Solder Mask (*.GTS)
Required
Bottom Solder Mask (*.GBS)
Required
Top Silkscreen (*.GTO)
Required
Bottom Silkscreen (*.GBO)
Optional
📐
Drill & Assembly Files
Additional manufacturing files
Drill Files
NC Drill File (*.DRL, *.XLN)
Required
Board Outline (*.GKO)
Required
Drill Drawing (*.GD1)
Recommended
Assembly Files
Top Paste (*.GTP)
For SMT
Bottom Paste (*.GBP)
For SMT
Pick & Place (*.csv)
For Assembly
Bill of Materials (BOM)
For Assembly
Documentation
Fabrication Notes (README)
Recommended
Stack-up Specification
For multi-layer
Impedance Requirements
If controlled